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Aluminum Nitride (AlN) Ceramics For Electronic Packages

Materials:

Aluminium Nitride Ceramic

Product Category:

Ceramic Substrate

Overview
Aluminum Nitride (AlN) is a special technical ceramic as we all know with high thermal conductivity, low dielectric constant, but the unique is its low CTE (coefficient of thermal expansion) close to that of Silicon. This unusual combination of properties makes AlN a critical advanced material for many future applications in electronic packages.

Due to the high thermal conductivity, AlN efficiently releases the heat from high heat generating IC chips. It can easily be laser cut into the thin thickness and complex geometries.

Advantages

  1. High thermal conductivity: 170-230W/M.K, 5-10 times than Alumina
  2. Low dielectric constant
  3. Low CTE (coefficient of thermal expansion)
  4. Excellent electrical insulation
  5. Non-toxic
  6. High temperature resistance: Chemically stable up to 980°C in H2 and CO2 atmospheres, and in the air up to 1380°C
  7. Resistance to corrosion and erosion

General Dimension from INNOVACERA

Square Substrates:
Thickness: 0.385mm, 0.5mm, 0.635mm, 1mm
Length x Width (mm): 50.8 x 50.8, 76.2 x 76.2, 101.6 x 101.6, 114.3 x 114.3

Round Substrates:
Thickness: 1mm, 1.2mm, 1.5mm, 2mm, 2.5mm
Diameter (mm): OD19 * ID16, OD26 * ID20,  OD35 * ID30, OD45 * ID40, OD52 * ID50, D60, D75, D80

Applications

  • 5G Communication
  • LED lighting
  • HBLED
  • SMD Encapsulation
  • Semiconductor
  • High-power electronics insulators
  • Microelectronics & Microwave packages
  • Heat sinks & heat spreaders
  • Silicon wafer handling and processing
  • Substrates for electronic packages
  • Chip carriers for sensors and detectors
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